Calculates the power dissipated by means of a heat sink formed directly on the printed circuit with variable size and form.
This type of sink is suitable for treating low power and is essential for components with only solder terminals.
Maximum ambient temperature expected.
Maximum operating temperature of the heat sink.
Notes on the calculation results.
The calculation refers to supports in epoxy glass with copper plating standard thickness for media bakelite the result of maximum power dissipation goes downgraded.
The heat sink must be insulated to allow the direct contact of the heating element with the heat sink itself, in some cases, and the welding of the component which transfers the heat (example diodes or power resistors).
The shape of the heat sink has a great influence due to the small thickness of copper available, for the best performance, the heating element can be placed at the center of the available space.
Pay close attention in setting the ambient temperature, ambient temperature is defined as the work of the printed circuit which is subject to heating induced by the components themselves.
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The applications on the dissipation.
Forced air cooling fins
Dissipation of containers
Forced ventilation of containers
NO. They are metal (aluminium or copper) and are2012-08-02 12:09:13 by CincyJimau
Attached to heat producing integrated circuits, such as a computers Central Processing Unit (CPU).
Normally thy are large finned hunks of metal with a fan blowing on the HS' fins to sweep away the heat.
Sink = to displace part of the heat of a integrated circuit and become totally or partially submerged or enveloped; fall or descend into or below the maximum allowed, functional, temperature.
Google for "heat sinks" & see the different types.
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